AOI Inspection (Engl)

Trevor Galbraith talks to TRI's Steve Marks about TRI's One Stop Solution for PCBA test and inspection and how it can integrate with both TRI's YMS 4.0 yield management system and PanaCIM's factory automation software.

Trevor Galbraith talks to TRI's Sales Manager Tom Tu about TRI's newly released 3D SPI TR7700DI/QI Plus. Featured Product: 3D SPI TR7007Q Plus: https://www.tri.com.tw/en/product/product_detail-10-2-1592-1.html 3D SPI TR7007D Plus: https://www.tri.com.tw/en/product/product_detail-10-2-1593.html Credits: GlobalSMT Source: https://www.shorturl.at/tvJ34

The TR7700Q SII-S is built on a 2.5 μm high-resolution platform featuring 25 MP imaging technology designed for the Semiconductor & Advanced Packaging Industry. AI-powered algorithms and metrology capabilities enhance the Smart 3D AOI solution's effectiveness. The 3D SEMI AOI solution can inspect wire diameters of up to 15 μm (0.6 mil). The 3D AOI supports current Smart Factory Standards, including IPC-CFX and The Hermes Standard (IPC-HERMES-9852). Inspection for: wire bonding, die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints. Features: • 2.5 μm High-Resolution 3D SEMI Back-end AOI • Precise Metrology-Grade Measurements* • AI-powered Inspection with AI Smart Programming* • Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions • Bond Inspection: ball bond, wedge bond, and ribbon bond • Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping* • Industry 4.0 Ready Platform *Optional See More: https://www.tri.com.tw/en/product/product_detail-70-2-1790-1.html

The TR7700QC SII 3D AOI is equipped with essential inspection functionalities for multiple electronics manufacturing industry applications. The 3D AOI features user-friendly programming for easy setup, flexible IPC-610 inspection algorithms, and compliance with the latest Smart Factory standards. • 3D AOI with Essential Features for Components and Solder Joints Inspection • User-Friendly Programming and IPC-610 Flexible Algorithms • Industry-leading Inspection Speed of up to 57 cm2/sec • Tall Component Inspection 3D Height Range up to 40 mm • Smart Factory Ready Solution For more information, please visit, https://www.tri.com.tw/en/product/product_detail-11-2-1817-1.html

The TR7500QE Plus is the next generation Multi camera side view 3D AOI. The cost-effective 3D AOI platform is equipped with innovative AI-powered algorithms and increased mechanical capabilities that offer high accuracy inspection. The Side View cameras allow the platform to inspect inner layer bridges, underfill, hidden lifted leads and other out of sight defects. The TR7500QE Plus supports current Smart Factory Standards, such as IPC-CFX and The Hermes Standard (IPC-HERMES-9852). Features: • Multi-Angle 3D Side View, 5 Cameras Inspection • Metrology-Grade Measurements • AI-powered Algorithms with Smart Programming • Inspection for: Inner layer bridge, underfill, hidden lifted lead, etc. • Industry 4.0 Ready Platform For more information please visit, https://www.tri.com.tw/en/product/product_detail-11-2-1650-1.html

Automated Optical Inspection (AOI) Product Line Introduction Ultra-high Precision Camera 3D AOI. -Multiple 3D technologies: Zero Escapes Inspection -Up to 1um Optical Resolution -Smart Inspection Library: Ease of Programming -Real-Time SPC Trends More Information: https://www.tri.com.tw/en/product/product-11-2.html

Depth from focus (DFF) is a revolutionary 3D sensing technique that searches for optimal focus position, supporting 1 μm ultra-high-resolution inspection.

Artificial Intelligence is becoming an essential tool towards no false calls and no escapes. AI facilitates predictive decision-making similar to an expert or experienced operator, increasing inspection accuracy by up to 90%. TRI's AI-powered solutions offer revolutionary inspection algorithms, automated fine-tuning, and a Smart Repair Station.

A brief introduction to TRI's latest Automated Optical Inspection solutions for the PCB manufacturing industry.