AOI Inspection (Engl)
Zuletzt aktualisiert:
05.02.2025
Completed
TRI AI Powered Inspection
188 Ansichten •TRI Depth From Focus (DFF) 3D Technology
174 Ansichten •Automated Optical Inspection (AOI) Product Line Introduction
191 Ansichten •TRI - Multi Camera Side View 3D AOI - TR7500QE Plus
197 Ansichten •TRI - 3D AOI Core Features- TR7700QC SII
207 Ansichten •TRI - 3D SEMI AOI - TR7700Q SII-S - Back-End Advanced Packaging Inspection
231 Ansichten •2021 productronica interview with Tom Tu, TRI's Sales Manager
235 Ansichten •2016 APEX interview with Steve Marks about TRI PanaCIM Solutions
201 Ansichten •TRI AOI Solutions
177 Ansichten •2021 productronica interview with Tom Tu, TRI's Sales Manager
235 Ansichten •TRI - 3D SEMI AOI - TR7700Q SII-S - Back-End Advanced Packaging Inspection
231 Ansichten •TRI - 3D AOI Core Features- TR7700QC SII
207 Ansichten •2016 APEX interview with Steve Marks about TRI PanaCIM Solutions
201 Ansichten •TRI - Multi Camera Side View 3D AOI - TR7500QE Plus
197 Ansichten •Automated Optical Inspection (AOI) Product Line Introduction
191 Ansichten •TRI AI Powered Inspection
188 Ansichten •TRI AOI Solutions
177 Ansichten •TRI Depth From Focus (DFF) 3D Technology
174 Ansichten •TRI - 3D SEMI AOI - TR7700Q SII-S - Back-End Advanced Packaging Inspection
The TR7700Q SII-S is built on a 2.5 μm high-resolution platform featuring 25 MP imaging technology designed for the Semiconductor & Advanced Packaging Industry. AI-powered algorithms and metrology capabilities enhance the Smart 3D AOI solution's effectiveness. The 3D SEMI AOI solution can inspect wire diameters of up to 15 μm (0.6 mil). The 3D AOI supports current Smart Factory Standards, including IPC-CFX and The Hermes Standard (IPC-HERMES-9852).
Inspection for: wire bonding, die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints.
Features:
• 2.5 μm High-Resolution 3D SEMI Back-end AOI
• Precise Metrology-Grade Measurements*
• AI-powered Inspection with AI Smart Programming*
• Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping*
• Industry 4.0 Ready Platform
*Optional
See More: https://www.tri.com.tw/en/product/product_detail-70-2-1790-1.html
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