AOI Inspection (Engl)
Zuletzt aktualisiert:
05.02.2025
Completed
TRI AI Powered Inspection
492 Ansichten •TRI Depth From Focus (DFF) 3D Technology
416 Ansichten •Automated Optical Inspection (AOI) Product Line Introduction
460 Ansichten •TRI - Multi Camera Side View 3D AOI - TR7500QE Plus
460 Ansichten •TRI - 3D AOI Core Features- TR7700QC SII
508 Ansichten •TRI - 3D SEMI AOI - TR7700Q SII-S - Back-End Advanced Packaging Inspection
532 Ansichten •2021 productronica interview with Tom Tu, TRI's Sales Manager
537 Ansichten •2016 APEX interview with Steve Marks about TRI PanaCIM Solutions
473 Ansichten •TRI AOI Solutions
425 Ansichten •2021 productronica interview with Tom Tu, TRI's Sales Manager
537 Ansichten •TRI - 3D SEMI AOI - TR7700Q SII-S - Back-End Advanced Packaging Inspection
532 Ansichten •TRI - 3D AOI Core Features- TR7700QC SII
508 Ansichten •TRI AI Powered Inspection
492 Ansichten •2016 APEX interview with Steve Marks about TRI PanaCIM Solutions
473 Ansichten •TRI - Multi Camera Side View 3D AOI - TR7500QE Plus
460 Ansichten •Automated Optical Inspection (AOI) Product Line Introduction
460 Ansichten •TRI AOI Solutions
425 Ansichten •TRI Depth From Focus (DFF) 3D Technology
416 Ansichten •TRI - 3D SEMI AOI - TR7700Q SII-S - Back-End Advanced Packaging Inspection
The TR7700Q SII-S is built on a 2.5 μm high-resolution platform featuring 25 MP imaging technology designed for the Semiconductor & Advanced Packaging Industry. AI-powered algorithms and metrology capabilities enhance the Smart 3D AOI solution's effectiveness. The 3D SEMI AOI solution can inspect wire diameters of up to 15 μm (0.6 mil). The 3D AOI supports current Smart Factory Standards, including IPC-CFX and The Hermes Standard (IPC-HERMES-9852).
Inspection for: wire bonding, die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints.
Features:
• 2.5 μm High-Resolution 3D SEMI Back-end AOI
• Precise Metrology-Grade Measurements*
• AI-powered Inspection with AI Smart Programming*
• Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping*
• Industry 4.0 Ready Platform
*Optional
See More: https://www.tri.com.tw/en/product/product_detail-70-2-1790-1.html
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